| What is ELEP Masking?
The ELEP Masking Series is used in
various of plating processes for printed
circuit boards manufacturing. Products
can be selected according to the type
of plating process as Nitto Denko
makes available types for protecting
circuit against plating fluid, flux
and solder, and heat. And, with Nitto
Denko’s featured adhesion control,
those products offer both properties
of high adhesion and easy peeling
with almost no adhesive residue.
| Product No. |
Thickness
(mm) |
Width
(mm) |
Length
(mm) |
Adhesive Length
(N/20mm) |
Tensile Strength
(N/20mm) |
Elongation
(%) |
Colour |
| Green |
Light Blue |
White |
Cream |
| N-300 |
0.1 |
6,
9, 12
15, 18
|
30.100 |
5.49 |
78.4 |
90 |
 |
- |
- |
- |
| N-380 |
0.08 |
20-300
|
100 |
0.98 |
39.2 |
240 |
- |
|
- |
- |
| N-700S |
0.28 |
12,
15, 18 |
50 |
6.68 |
78.4 |
7.0 |
- |
- |
|
- |
| N-800 |
0.14 |
4,
6, 9
12, 15, 18
|
50 |
4.9 |
75.5 |
19.0 |
- |
- |
- |
|
Precautions when using
• Store at room
temperature and humidity where not
exposed to direct sunlight. Improper
conditions can cause tape edges to
rise.
• When laminating tape, do not
pull harder than necessary. Excessive
pulling can cause tape edges to rise.
|
